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Home
»
Documentation
» Package Information
Package Information
AC174: Assembly Instructions for CQFP Packages SMT on PCB App Note
159 KB
6/2003
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AC193: Ceramic Chip Carrier Land Grid (CC256) Package Handling App Note
207 KB
11/2003
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AC195: Prototyping for the RT54SX-S Enhanced Aerospace FPGA App Note
Pin Mapping List for A54SX32A CQ256 to FG484 Adapter
(XLS, 75 KB)
Pin Mapping List for A54SX72A CQ256 to FG484 Adapter
(XLS, 186 KB)
601 KB
4/2012
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AC220: Package Thermal Characteristics App Note
80 KB
2/2005
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AC243: Assembly and PCB Layout Guidelines for Chip-Scale Packages App Note
2 MB
5/2009
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AC274: CQFP to FBGA Adapter Sockets App Note
Pin Mapping List for RTAX1000S (or AX1000) CQ352 to AX1000 FG896 Adapter
(XLS, 985 KB)
Pin Mapping List for RTAX2000S (or AX2000) CQ352 to FG896 Adapter
(XLS, 499 KB)
Pin Mapping List for RTAX2000S (or AX2000) CQ256 to FG896 Adapter
(XLS, 214 KB)
Pin Mapping List for RTAX250S (or AX250) CQ352 to AX250 FG484 Adapter
(XLS, 177 KB)
7 MB
11/2011
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AC275: Actel CCGA to FBGA Adapter Socket Instructions App Note
Pin Mapping List for RTAX1000S (or AX1000) CG624 to AX1000 FG896 Adapter
(XLS, 868 KB)
Pin Mapping List for RTAX2000S (or AX2000) CG624 to AX2000 FG896 Adapter
(XLS, 292 KB)
2 MB
11/2011
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AC322: Assembly and PCB Layout Guidelines for QFN Packages App Note
869 KB
5/2008
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AC341: Actel CCGA to CLGA Adapter Socket Application Note
946 KB
8/2010
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AC342: Actel CQFP to CLGA Adapter Socket Application Note
588 KB
3/2010
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Actel CCGA Board Level Testing Report
2 MB
3/2007
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Actel RoHS Certificate of Compliance
314 KB
4/2009
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Backward Compatibility of RoHS Compliant Components
22 KB
7/2006
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BGA Handling Instructions
53 KB
6/2003
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CG1152 Daisy Chain Package Drawing
1 MB
8/2005
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CG1272 Daisy Chain Package Drawing
2 MB
8/2005
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CG624 Daisy Chain Package Drawing
1 MB
9/2007
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EIA Standard Board Layout Drawing for BGA, CCGA, CSP, and QFN
Design Files
(ZIP, 216 KB, 3/08)
479 KB
7/2009
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EIA Standard board layout drawing for PLCC package
259 KB
6/2003
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EIA Standard Board Layout of Soldered Pad for QFP Devices and QFP Surface Mount Socket
325 KB
5/2012
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Environmental Packaging FAQs
51 KB
3/2004
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Environmental Policy
1 MB
3/2006
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EU RoHS and PFOS, PFOA, and Deca-BDE Compliance Customer Letter
22 KB
9/2008
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Green Packaging Brochure
861 KB
5/2004
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Hermetic Package Mechanical Configuration
24 KB
11/2003
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Leadframe Rework on Microsemi CQFP Packages
152 KB
6/2011
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Mechanical Drawings for Prototyping Sockets
18 KB
8/2007
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Mechanical Drawings for the Adapter Board
10 KB
8/2008
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Microsemi SoC Products Group's Position On REACH
(Registration, Evaluation, Authorisation and Restriction of Chemicals)
131 KB
3/2012
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Moisture Sensitivity
225 KB
3/2011
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Package Mechanical Drawings
(Revision 42)
6 MB
4/2012
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Package Thermal Characteristics and Weights
49 KB
10/2006
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Packaging FAQ
1 MB
6/2011
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Packaging Material Information
37 KB
11/2003
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Plastic Packages Containing a Heat Spreader
21 KB
6/2003
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PQFP Handling Instructions
374 KB
11/2006
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Prohibitive Substances
21 KB
8/2007
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Prototyping Socket Electrical data list
5 KB
10/2001
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Socket Assembly Instructions for QFP and BGA (Ball Grid Array) packages
81 KB
10/2001
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Sockets for Actel FPGAs
150 KB
3/2010
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Solder Reflow Profile for Standard and Lead-Free Packages
364 KB
4/2012
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Tape and Reel Packaging
35 KB
1/2004
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Tray Drawings
18 KB
4/2007
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Use of Pure Tin Components Intended for Space Application
18 KB
8/2011
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Visual Inspection Criteria for Actel CQFP Packages
107 KB
6/2003
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